Driving Power Density to the Next Level


  • Compact, Space Saving Footprint
  • Ultra-low On-Resistance
  • Reliable and Manufacturable
  • High Current Rating

Providing a true alternative to D2PAK, Nexperia's LFPAK88 delivers industry-leading power density up to 48 times when compared to D2PAK devices, in a truly innovative 8 x 8 mm footprint. Delivering two times higher continuous current ratings (up to 425 A), ultimate thermal performance and reliability, and up to 60% space efficiency, making LFPAK88 the MOSFET of choice for the most challenging new designs. Using the latest silicon technology resulting in 40 V MOSFETs delivering a low RDS(ON) of 0.7 mΩ. Available in both automotive AEC-Q101 (BUK) and industrial grades (PSMN).

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  • Compact Footprint (D2PAK Replacement; Low Profile)
  • Manufacturability & Robustness (Flexible Leads for Temp Cycling Reliability; Compatible with SMD Soldering and AOI)
  • High-Performance Silicon (0.7 mΩ Trench 9 40 V; Improved SOA)
  • Copper Clip:
    • tested High IDMAX Rating (425 A)
    • Low Inductance (1 nH)
    • Current Spreading
    • Low RDS(ON)
  • Low Thermal Resistance:
    • Low Rth(j-mb) Typ. (0.25 K/W)
  • Qualification:
    • AEC-Q101
    • +175 ˚C Rating
    • MSL1
    • Halogen-Free
  • 12 V Automotive Systems
  • 48 V DC/DC Systems (on 12 V Secondary Side)
  • Higher-Power Motors, Lamps, and Solenoid Control
  • Reverse Polarity Protection
  • LED Lighting
  • Ultra-High Performance Power Switching
  • Brushless DC motor control
  • Synchronous Rectifier in High-Power AC-DC Applications
  • Battery Protection
  • eFuse and Load Switch
  • Hotswap / In-Rush Current Management
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