- Compact, Space Saving Footprint
- Ultra-low On-Resistance
- Reliable and Manufacturable
- High Current Rating
Providing a true alternative to D2PAK, Nexperia's LFPAK88 delivers industry-leading power density up to 48 times when compared to D2PAK devices, in a truly innovative 8 x 8 mm footprint. Delivering two times higher continuous current ratings (up to 425 A), ultimate thermal performance and reliability, and up to 60% space efficiency, making LFPAK88 the MOSFET of choice for the most challenging new designs. Using the latest silicon technology resulting in 40 V MOSFETs delivering a low RDS(ON) of 0.7 mΩ. Available in both automotive AEC-Q101 (BUK) and industrial grades (PSMN).
- Compact Footprint (D2PAK Replacement; Low Profile)
- Manufacturability & Robustness (Flexible Leads for Temp Cycling Reliability; Compatible with SMD Soldering and AOI)
- High-Performance Silicon (0.7 mΩ Trench 9 40 V; Improved SOA)
- Copper Clip:
- tested High IDMAX Rating (425 A)
- Low Inductance (1 nH)
- Current Spreading
- Low RDS(ON)
- Low Thermal Resistance:
- Low Rth(j-mb) Typ. (0.25 K/W)
- Qualification:
- AEC-Q101
- +175 ˚C Rating
- MSL1
- Halogen-Free
- 12 V Automotive Systems
- 48 V DC/DC Systems (on 12 V Secondary Side)
- Higher-Power Motors, Lamps, and Solenoid Control
- Reverse Polarity Protection
- LED Lighting
- Ultra-High Performance Power Switching
- Brushless DC motor control
- Synchronous Rectifier in High-Power AC-DC Applications
- Battery Protection
- eFuse and Load Switch
- Hotswap / In-Rush Current Management