- Toshiba 64-Layer BiCS FLASH™
- PCIe® Gen3*2L NVMe™
- Capacities up to 512GB
- M.2 1620 single package and M.2 2230 single-sided form factor
The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.
BG3 SSDs an innovative, next generation single-package ball grid array (BGA) SSD product line.
The devices harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage
The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
- Ultra-mobile PCs
- 2-in-1 notebook PCs
- IoT/embedded devices
- Server and storage array boot drives